Double-Side Polished (DSP) Fused Quartz/Silica Wafers in Stock:
Size: Four Inch 4''(100.0 mm); Thickness: 400 um+/- 10 um; Grade: JGS1
Size: Four Inch 4''(100.0 mm); Thickness: 400 um+/- 10 um; Grade: JGS2
Technical Processing Data:
- TTV < 5 μm, BOW < 30 μm, Roughness < 1.0 nm;
Volume and Custom Orders Available Upon Request.
Double-Side Polished (DSP) Fused Quartz/Silica Wafers
40,00C$Prix