Ultra- Flat Diced Silicon Substrates (25 pcs in Gel Membrane Boxes) in Stock:
 
Size: 5.00 mm x 5.00 mm Diced Chips; Thickness: 525 um+/- 10 um; 
Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 30 Ω·cm
Size: 10.00 mm x 10.00 mm Diced Chips; Thickness: 650 um+/- 10 um; 
Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 30 Ω·cm
Size: 5.00 mm x 5.00 mm Diced Chips; Thickness: 525 um+/- 10 um; 
Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 50 Ω·cm
200 nm+/-10 nm Dry Oxide Layers on Both Sides

Technical Processing Data:
 
Orientation: <100>+/- 0.5°;
TIR < 3 μm, TTV < 10 μm, BOW < 10 μm
Roughness < 0.5 nm;

Volume and Custom Orders Available Upon Request.