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Diced Silicon Substrates

Ultra- Flat Diced Silicon Substrates (25 pcs in Gel Membrane Boxes) in Stock:
 

  • Size: 5.00 mm x 5.00 mm Diced Chips; Thickness: 525 um+/- 10 um; 

    Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 30 Ω·cm

  • Size: 10.00 mm x 10.00 mm Diced Chips; Thickness: 650 um+/- 10 um; 

    Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 30 Ω·cm

  • Size: 5.00 mm x 5.00 mm Diced Chips; Thickness: 525 um+/- 10 um; 

    Type: P/Boron-Doped; Orientation: <100>+/- 0.5°; Resistivity: 1 - 50 Ω·cm

    200 nm+/-10 nm Dry Oxide Layers on Both Sides


Technical Processing Data:
 

  • Orientation: <100>+/- 0.5°;
  • TIR < 3 μm, TTV < 10 μm, BOW < 10 μm
  • Roughness < 0.5 nm;


Volume and Custom Orders Available Upon Request.
 

Diced Silicon Substrates

48,00C$Prix
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